The Datasheet Archive
Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers
Search
DSA00299950.pdf
Manufacturer
Central Semiconductor
Partial File Text
PROCESS CP608 Power Transistor PNP - Amp/Switch Transistor Chip PROCESS DETAILS Process EPITAXIAL BASE Die Size 66 X 66 MILS Die Thickness 12.5 ± 1.0 MILS Base Bonding
Datasheet Type
Original
ECAD Model
Part Details
Price & Stock Powered by
Findchips
DSA00299950.pdf preview
Download Datasheet
User Tagged Keywords
CJD32C
CP608
TIP32C