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DSAE0014168.pdf
Manufacturer
Intersil
Partial File Text
Plastic Packages for Integrated Circuits Quad Flat No-Lead Plastic Package (QFN) Micro Lead Frame Plastic Package (MLFP) L24.6x6 24 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO
Datasheet Type
Original
ECAD Model
Part Details
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DSAE0014168.pdf preview
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User Tagged Keywords
MO-220
TB389
Technical Brief TB389