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DSADA0023276.pdf
Manufacturer
Philips Semiconductors
Partial File Text
PDF: 2002 May 14 Philips Semiconductors Package outline HTSSOP8: plastic thermal enhanced thin shrink small outline package; 8 leads; body width 3 mm; exposed die pad SOT770-1 E D
Type
Original
ECAD Model
Part Details
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HTSSOP-8
sot770