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    DSAZSAA00018904.pdf

    • NXP Semiconductors
    • <Package outline> HXQFN60: plastic compatible thermal enhanced extremely thin quad flat package; no leads; 60 terminals; body 4 x 6 x 0.5 mm A B D SOT1134-2 terminal 1 index area A
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    DSAZSAA00018904.pdf preview Download Datasheet

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