DSAZIHA2X00062625.pdf

Manufacturer Micrel Semiconductor
Partial File Text Reportable Substances in Components Package Type : Lead #: No 1 Component Weight : SOICN-Epad(0.150") Document No : 8 Process Type : Material Molding Compound Content in % 56.127%
Type Original
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DSAZIHA2X00062625.pdf preview Download Datasheet