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DSASW00296625.pdf
Manufacturer
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Partial File Text
Reliability of Chip Scale Packages under Mechanical Shock Loading T. T. Mattila1, P. Marjamäki1, L. Nguyen2, and J. K. Kivilahti1 1 Laboratory of Electronics Production Technology Helsinki Unive
Type
Original
ECAD Model
DSASW00296625.pdf preview
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User Tagged Keywords
AA-36
AA100
heraeus
JESD22-B111
JESD22B111
LLP48
multicore solder paste