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DSAUTAZ00379.pdf
Manufacturer
Hewlett-Packard
Partial File Text
INA Bonding Configurations Application Bulletin 0007 Introduction This Application Bulletin provides assembly information for the INA family of MagICTM MMIC low noise amplifiers. Three chip geo
Type
Original
ECAD Model
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AN-A005
an-s012
chip die hp transistor
HP MMIC INA
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