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    DASF0048095.pdf

    • Advanced Semiconductor Engineering
    • Package Material Composition and Mass Calculation Customer:Vitesse Package:23x23 HSBGA Device Type:VSC452XHW-02 Die Size: 7100 X 7300 um Total Pck. Weight (g): 2675.785 Provided By: Gerry Ala
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    DASF0048095.pdf preview Download Datasheet

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    2100a epoxy ABL-2100A G770* sumitomo G770* sumitomo composition G770J HSBGA HSBGA ase sac305 secret sumitomo epoxy VSC452XHW VSC452XHW-02

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