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    DSA00332070.pdf

    • Microsemi
    • GaAs Schottky Devices Low RS Flip Chip ® TM MS8150 - P2613 Dimensions Size: 26 x 13 mils Thickness: 5 mils Bond Pad Size: 5 x 8 mils Features Capacitance (65 fF Typ.) Lo
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    DSA00332070.pdf preview Download Datasheet

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    MS8150 MS8150-P2613 P2613
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