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    DSAZSAA00020246.pdf

    • NXP Semiconductors
    • PC board footprint NXP Semiconductors Footprint for reflow soldering of HVSON14 package SOT1054-1 4.200 pa + oa 3.500 0.500 oa 0.500 4.150 1.800 1.500 sr 0.800 0.250
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    DSAZSAA00020246.pdf preview Download Datasheet

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