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    DSASW00416773.pdf

    • White Electronic Designs
    • White Electronic Designs W364M72V-XSBX PBGA MULTI-CHIP PACKAGE CONSTRUCTION ENCAPSULANT TEST The encapsulant is not injection molded to control wire sweep effects Burn-In ­ 100%-48 ho
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    DSASW00416773.pdf preview Download Datasheet

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