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    DSA0023522.pdf

    • Texas Instruments
    • Application Report SZZA031 - December 2001 A Nickel-Palladium-Gold Integrated Circuit Lead Finish and Its Potential for Solder-Joint Embrittlement Donald Abbott, Douglas Romm, Bernhard Lange
    • Original
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    DSA0023522.pdf preview Download Datasheet

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    Cu OSP and Cu SOP DIAMOND TECHNOLOGIES gold embrittlement gold embrittlement palladium IPC-A-610C sn-pb-ag solder paste SZZA031

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