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    DSAE0020375.pdf

    • NXP Semiconductors
    • Package outline HXQFN60U: plastic thermal enhanced extremely thin quad flat package; no leads; 60 terminals; UTLP based; body 4 x 6 x 0.5 mm B D SOT1134-1 A terminal 1 index area E
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    DSAE0020375.pdf preview Download Datasheet

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