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DSA00260098.pdf
Manufacturer
STATS ChipPAC
Partial File Text
FBGA Fine Pitch Ball Grid Array · Array molded, cost effective, space saving package solution · Available in 1.40mm (LFBGA), 1.20mm (TFBGA), and 1.00mm (VFBGA), 0.80mm (WFBGA) and 0.55mm (UFBGA
Datasheet Type
Original
ECAD Model
Part Details
Part pricing, stock, data attributes from Findchips.com
DSA00260098.pdf preview
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User Tagged Keywords
AN 7823
JESD51-2
JESD51-9
lfbga Encapsulation thermal resistance
tfBGA PACKAGE thermal resistance
TRAY 15X15
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VFBGA package tray
vFBGA* 96 bALL
WFBGA
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