Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    DSASW00135383.pdf

    • -
    • PROCESS CP211 Power Transistor NPN - Amp/Switch Transistor Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 80 x 99 MILS Die Thickness 12.5 MILS Base Bonding Pad A
    • Original

    DSASW00135383.pdf preview Download Datasheet

    User Tagged Keywords

    2N3054A chip die npn transistor CJD41C CP211 TIP41C transistor CR NPN

    Newly Added Datasheets | Privacy Policy | Digital Services Act | Contact Us | About Us

    Copyright © 2024.

    Supplyframe Tracking Pixel