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    DSAUD005443.pdf

    • Texas Instruments
    • TMS320C6x Manufacturing with the BGA Package APPLICATION REPORT: SPRA429 David Bell Digital Signal Processing Solutions March 1998 IMPORTANT NOTICE Texas Instruments (TI) reserves the ri
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    DSAUD005443.pdf preview Download Datasheet

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    "0.4mm" bga "ball collapse" height 0.35mm BGA 0.4mm pitch BGA routing AN1231 BGA 0.35mm pitch BGA NSMD ball BGA Package 0.35mm pitch BGA Solder Ball 0.35mm BGA Solder Ball 0.35mm collapse BGA Solder Ball collapse SPRA429 TMS320 tms320 solder reflow TMS320C6201 TMS320C6x
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