DSAZSAA00019959.pdf

Manufacturer NXP Semiconductors
Partial File Text Package outline HLLGA48R: plastic thermal enhanced low profile land grid array package; 48 lands; resin based; body 8 x 7 x 1.25 mm D SOT863-1 A B land 1 index area E e1 L1 v
Type Original
ECAD Model
Part Details Part pricing, stock, data attributes from Findchips.com

DSAZSAA00019959.pdf preview Download Datasheet