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    DSAH00112332.pdf

    • Cal-Chip Electronics
    • Wire Wound Chip InductorWB Series Construction 4 1 3 2 1 Ceramic Core 2 Magnet Wire 3 4 Electrode (Ag/Pd+Ni+Sn) UV Glue Features Ceramic base provide high SRF Ultra-compact inductors
    • Original
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    DSAH00112332.pdf preview Download Datasheet

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