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    DSAISS0006676.pdf

    • Central Semiconductor
    • PROCESS CPS130 Silicon Controlled Rectifier 16 Amp Sensitive Gate SCR Chip PROCESS DETAILS Process GLASS PASSIVATED MESA Die Size 130 x 130 MILS Die Thickness 8.7 MILS Cat
    • Original
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    DSAISS0006676.pdf preview Download Datasheet

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