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    DSAEDA000138350.pdf

    • Microsemi
    • GaAs Schottky Diodes Flip Chip Anti Parallel Low RS ® TM MS8250 – P2920 Dimensions Size: 26 x 13 mils Thickness: 5 mils Bond Pad Size: 5 x 8 mils Features Capacitance (65 fF Typ
    • Original
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    DSAEDA000138350.pdf preview Download Datasheet

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