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    DSADA0023399.pdf

    • Philips Semiconductors
    • Package outline Philips Semiconductors VFBGA353S: plastic very thin fine-pitch ball grid array package; 353 balls; top 152 lands; stackable; body 14 x 14 x 0.6 mm B D e4 D1 2 4 1
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    DSADA0023399.pdf preview Download Datasheet

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