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    DSAISS0006709.pdf

    • Central Semiconductor
    • PROCESS TRIAC CPQ090 4 Amp, 600 Volt TRIAC Chip PROCESS DETAILS Process GLASS PASSIVATED MESA Die Size 90 x 90 MILS Die Thickness 8.6 MILS ± 0.6 MILS MT1 Bonding Pad Area
    • Original
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    DSAISS0006709.pdf preview Download Datasheet

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