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    DSA00299950.pdf

    • Central Semiconductor
    • PROCESS CP608 Power Transistor PNP - Amp/Switch Transistor Chip PROCESS DETAILS Process EPITAXIAL BASE Die Size 66 X 66 MILS Die Thickness 12.5 ± 1.0 MILS Base Bonding
    • Original
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    DSA00299950.pdf preview Download Datasheet

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    CJD32C CP608 TIP32C

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