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DSASW00186962.pdf
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Stacked MCP Stacked Multi-Chip Package (Stacked MCP) is one of the most suitable chip scale packages for wireless applications. Its advantage is the compact stacked chip configuration. In the Flash
Type
Original
ECAD Model
DSASW00186962.pdf preview
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32M X 32 MEMORY
BGA NAND Flash
BGA PACKAGE thermal profile
BGA-56P-M01
FBGA56
FBGA69
FBGA71
FLASH BGA
MCP NAND
NAND FLASH BGA