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DSASW0048256.pdf
Manufacturer
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Partial File Text
Development of BGA Solution for the IBM PowerPC 970 Module in Apple's Power Mac G5 Presented at ECTC 2004 David Edwards*, Hope Chambers**, Mukta Farooq*, Lewis Goldmann*, Amir Salehi** *IBM Microel
Type
Original
ECAD Model
DSASW0048256.pdf preview
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User Tagged Keywords
BGA heatsink compressive force
BGA Solder Ball compressive force
bga thermal cycling reliability
MULTIPLE EFFECT EVAPORATOR
original Coffin-Manson Equation
PowerPC 970
reflow temperature bga
underfill
underfill SMT