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    DSAZSAA00019709.pdf

    • NXP Semiconductors
    • Package outline HLQFP144: plastic thermal enhanced low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm; exposed die pad SOT612-3 c y exposed die pad X A Dh 73 72
    • Original
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    DSAZSAA00019709.pdf preview Download Datasheet

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