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DSA00186014.pdf
Manufacturer
STMicroelectronics
Partial File Text
TN0019 Technical note MEMS in QFPN package surface mounting guidelines Introduction This document is a general guideline about soldering MEMS products packaged in Quad Flat Package No lead surfac
Type
Original
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4x4x1
7551-1
7x7x1
MEMS ic
qfn 28 land pattern
qfn 44 PACKAGE footprint
QFPN 28 footprint
QFPN-24
QFPN-28
TN0019
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