DSASW00420052.pdf

Manufacturer Xilinx
Partial File Text 1759 Ball Flip-Chip BGA (FF1759/FFG1759) Package PK385 (v1.1) November 12, 2010 X-Ref Target - Figure 1 BOTTOM VIEW TOP VIEW 0.20 4X B D1 D A B C D E F G H J K L
Type Original
ECAD Model
Part Details
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