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DSASW00296626.pdf
Manufacturer
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Partial File Text
Solder Joint Reliability Model with Modified Darveaux's Equations for the micro SMD Wafer Level-Chip Scale Package Family L. Zhang, R. Sitaraman*, V. Patwardhan, L. Nguyen, and N. Kelkar National S
Type
Original
ECAD Model
DSASW00296626.pdf preview
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