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DSAE0028260.pdf
Manufacturer
Freescale Semiconductor
Partial File Text
Freescale Semiconductor Application Note Document Number: AN3311 Rev. 1.0, 10/2009 Considerations for the Application of Land Grid Array (LGA) Style Packages 1 Introduction This appl
Type
Original
ECAD Model
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User Tagged Keywords
AN1902
AN3281
AN3311
BGA PACKAGE thermal resistance Freescale
bga PCB footprint
fr-5 laminate
Lead Free reflow soldering profile BGA
LGA PACKAGE thermal resistance Freescale
LGA voiding
reflow profile FOR LGA COMPONENTS