GHz BGA Sockets-1.27mm; IC Size X (mm): 42.5; IC Size Y (mm): 42.5; IC Array X: 33; IC Array Y: 33; Max Pincount: 1005; Top Pitch (mm): 1.27; IC Ball Coplanarity (mm): 0.2; IC Ball Diameter Max (mm): 0.9; IC Ball Height Max (mm): 0.7; IC Ball Height Min (mm): 0.5; IC Size Tolerance (mm): 0.2; IC Total Height Max (mm): 2.79; Max Package Code: Backing Plate: yes; Cavity Down: no; Heat Sink: yes; IC Top Surface: Flip Chip; Socket Lid: Screws; Part Description: GHz BGA Socket (ZIF)
Findchips
