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DSAEDA000138350.pdf
Manufacturer
Microsemi
Partial File Text
GaAs Schottky Diodes Flip Chip Anti Parallel Low RS ® TM MS8250 â P2920 Dimensions Size: 26 x 13 mils Thickness: 5 mils Bond Pad Size: 5 x 8 mils Features Capacitance (65 fF Typ
Type
Original
ECAD Model
Part Details
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