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    DSAZIHA1000118211.pdf

    • KOA Speer Electronics
    • NETWORKS KOA´S INTEGRATED PASSIVE COMPONENTS 3 THIN FILM ON SILICON (TFOS) KPC STRUCTURE 2 1 1 2 3 4 5 6 7 Die pad Silicon substrate Circuit Bonding pad Lead Mold
    • Original
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    DSAZIHA1000118211.pdf preview Download Datasheet

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