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    DSA2IH00202629.pdf

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    • 6. PACKING INFORMATION To deliver flat IC packages, three package method are available: the same stick packages as the ordinary DIP type, taping, and embossed taping. 6-1 Stick Specifications for Flat
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    EIA and EIAJ standards EIA and EIAJ tape standards RC-1009B TA7745 TE3212 TE32D
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