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    DSAZSAA00017556.pdf

    • NXP Semiconductors
    • SOT119A CDFM6; blister pack packing method; standard product orientation 12NC ending 112 Rev. 1 — 1 October 2012 Packing information 1. Packing method Blister cover ESD Label Foam
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    DSAZSAA00017556.pdf preview Download Datasheet

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