DSA2H0051081.pdf
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Foxconn
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SPECIFICATIONS
BGA 754 MB
BGA CPU Socket BGA SMT Type 1.27X1.27mm [.05 X.05"] Pitch 754 Pos.
Mechanical
Contact Rentention Force: 0.13kgf min. Durability: 50 Cycles min. Solder Ball Shear Forc
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Original
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Part pricing, stock, data attributes from Findchips.com
Findchips