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DSA00444866.pdf
Manufacturer
National Semiconductor
Partial File Text
External Lead Finish for Hermetic Packages For hermetic packages, National Semiconductor offers three primary lead finishes: solder dip, gold plate and tin plate. The component lead finish serves a
Datasheet Type
Original
ECAD Model
Part Details
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User Tagged Keywords
40 lead ceramic flatpack
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EXTERNAL LEAD FINISH FOR HERMETIC PACKAGES
gold plate
MIL-M38510 lead finish
National Semiconductor 16 Pin Dip