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DSASW00114692.pdf
Manufacturer
Anglia Catalog
Partial File Text
HEATSINKS & MOUNTINGS MOUNTING HARDWARE THERMAL INTERFACE MATERIALS KOOL-PADS ® KA150-2AC. Provides an efficient method of mounting heatsinks on to devices such as CPUs, DIL/SMT packages and ot
Type
Original
ECAD Model
DSASW00114692.pdf preview
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User Tagged Keywords
105AC-54
412423
471943
625AC-54
ADHESIVE GAP PAD
bergquist silpad k10
CLP-101
CM20-NA-213
CM20-NA-30X30
CM20-NA-819
graphite foil
graphite foil thermal interface resistance
Heatsinks TO247
k10 transistor
K10-104
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K177-065BQ35
K177-235BQ35
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K177-679BQ57
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K177-AC-065
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K177-NA-032
K177-NA-065
k177-na-30x30
K177-NA-353
K177-NA-819
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K200-AC-353
K200-AC-403
K200-NA-065
K200-NA-30X30
K200-NA-353
K200-NA-706
K200-NA-819
K6-54
KA150
KA150-2AC
KA150-2AC-30X30
Koolpad K200
Q3AC-300X300
Q3AC-35
SIL-PAD
thermal conductivity
to3 silpad
TSC209-ZP
TSC405
TSC405-ZP
TSC506-NY
TSC607-NY
TSC903