DSAH00480916.pdf

Manufacturer NXP Semiconductors
Partial File Text MF1ICS5005 Sawn bumped 120 µm wafer specification on UV tape Rev. 3.1 -- 10 February 2010 179131 Product data sheet addendum PUBLIC 1. General description The MF1ICS5005 is a contactless smart c
Type Original
ECAD Model
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