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DSA0055732.pdf
Manufacturer
Central Semiconductor
Partial File Text
Material Composition Specification SMDIP Case Pb (lead)-free plating** Device average mass . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300 mg Fluctuation marg
Datasheet Type
Original
ECAD Model
Part Details
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