DSA2IH0044457.pdf

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Partial File Text D E N S E -P A C MICROSYSTEMS DESCRIPTION: The DPZ256X16ln3 "STACK" modules are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers (SLCC).
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ECAD Model

DSA2IH0044457.pdf preview Download Datasheet