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    DSAZSAA00020241.pdf

    • NXP Semiconductors
    • Reflow soldering footprint Footprint information for reflow soldering of HXQFN16 package SOT1039-2 4.250 3.300 pa + oa 2.000 1.500 0.500 0.500 0.240 0.500 4.250 3.300 2.000
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