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DSAZSAA00017569.pdf
Manufacturer
NXP Semiconductors
Partial File Text
SOT171A CDFM6; blister pack; standard product orientation 12NC ending 112 Rev. 1 â 18 October 2012 Packing information 1. Packing method Blister cover ESD Label Foam Blister bot
Type
Original
ECAD Model
Part Details
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