DSAQ00271325.pdf

Manufacturer Bergquist
Partial File Text Gap Pad 3000S30 ® Thermally Conductive, Reinforced, Soft "S-Class" Gap Filling Material Features and Benefits · Thermal conductivity: 3.0 W/m-K · Low "S-Class" thermal resistance at very low pres
Type Original
Part Details Part pricing, stock, data attributes from Findchips.com

DSAQ00271325.pdf preview Download Datasheet