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    DSAZSAA00017497.pdf

    • NXP Semiconductors
    • Package outline Hermetically sealed glass package; ImplotecTM(1) technology; axial leaded; 2 leads SOD81 (2) G1 k a b D L G L DIMENSIONS (mm are the original dimensi
    • Original
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    DSAZSAA00017497.pdf preview Download Datasheet

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