DSAASSA0009342.pdf
- NXP Semiconductors
- Reflow soldering footprint Footprint information for reflow soldering of plastic surface-mounted package; 3 leads SOT323 2.65 1.85 1.325 2 2.35 0.6 (3×) 3 0.5 (3×) 1.3 1 0.55 (3×) solder
- Original
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