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DSASW00135460.pdf
Manufacturer
Central Semiconductor
Partial File Text
PROCESS CPZ19 Zener Diode 0.5 Watt Zener Diode Chip PROCESS DETAILS Process EPITAXIAL PLANAR Die Size 17.7 x 17.7 MILS Die Thickness 7.5 MILS Anode Bonding Pad Area 11
Datasheet Type
Original
ECAD Model
Part Details
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User Tagged Keywords
CMPZ5235B
CMPZ5261B
CPZ19
Diode c 642
Zener diode
zener diode chip
zener wafer
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