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    DSA00185412.pdf

    • Fairchild Semiconductor
    • Fairchild Semiconductor Application Note January 2001 Revised February 2001 Using BGA Packages Introduction Demanding space and weight requirements of personal computing and portable electron
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    0.35mm BGA fanout AN-5026 AN500543 AN5026 BGA 0.35mm pitch BGA 0.56mm BGA Package 0.35mm pitch BGA Solder Ball 0.35mm BGA Solder Ball 0.35mm collapse BGA Solder Ball collapse FSTD16211 FSTD32211
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