Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    DSA0034916.pdf

    • Motorola
    • Ceramic Ball Grid Array Packaging, Assembly & Reliability Andrew Mawer, Terry Burnette, Thomas Koschmeider and Diane Hodges Final Manufacturing Technology Center Motorola Semiconductor Products S
    • Original
    • Part pricing, stock, data attributes from Findchips.com

    DSA0034916.pdf preview Download Datasheet

    User Tagged Keywords

    90Pb 10Sn solder paste BGA and QFP Package ibm BGA cte BGA OUTLINE DRAWING BGA PROFILING BGA PROFILING leaded bga rework BGA Solder Ball collapse CBGA motorola ceramic rework fine BGA thermal profile hot air bga motorola ltcc MPC105 MPC106 MPC107 MPC107 RELIABILITY pcb warpage in ipc standard reflow hot air BGA thermocouple WELD
    Price & Stock Powered by Findchips

    Privacy Policy | Digital Services Act | Contact Us | About Us

    Copyright © 2024.

    Supplyframe Tracking Pixel