DSAUD0068014.pdf
-
Texas Instruments
-
Thermally
Enhanced ICs
Low Cost Plastic Package Improves Surface-Mount
IC Cooling
Milton L. Buschbom, Mark Peterson, Shih-Fang Chuang, David Kee, and
Buford Carter, Texas Instruments, Incorporate
-
Original
-
-
Part pricing, stock, data attributes from Findchips.com